The work instructions of datestamping personnel include: objectives, scope, responsibilities, working procedures, quality records of relevant documents before, during and after work, etc.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED operating instructions (a row of brackets) Page number: 3/27
Date: September 26th, 2005.
1. Objective: To strictly control the discharging process and ensure the product quality. 2. Scope of use: stent arrangement process. 3. Equipment used: tools-gloves, brackets, aluminum plates and colored pens. 4. Operating Specifications 4. 1 Wear gloves before operation. 4.2 According to the product name and specifications to be produced that day, select the required bracket and chip. 4.3 The bottom of the bracket shall be painted in accordance with regulations for later operation. 5. Precautions 5. 1 The layout should be neat, with a maximum of 50 brackets. If it is not enough, please indicate the quantity. 5.2 Solid two-color brackets are arranged at right angles to the right. The monochrome bracket is bowl-shaped to the left. 6. Quality standard 6. 1 In the process of discharging, if the bracket with abnormal color is found to be yellow or black, it should be picked out. 6.2 If the bracket is deformed, it should be picked out and treated as defective. If a large number of brackets are found to be deformed, please report the situation to the quality control personnel.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (crystal extension) Page number: 4/27
Date: September 26th, 2005.
1. Objective: To control the crystal expansion process and ensure the product quality. 2. Scope of application: crystal expansion process. 3. Equipment used: tools-crystal expander, subring and subring. 4. Related documents:>5. Operating Specification 5. 1: Extended Wafer. 1: Turn on the power switch of the crystal expander. 2: Adjust the temperature of the hot plate to 50-60℃ and heat it for 10 minute. 3. Open the press frame of the crystal puller, and put the inner ring of the daughter and mother rings on the hot plate, with a fillet facing upward. 4. To be expanded. Fasten the upper press frame. The mold is above and the film is below. 5. Press the top switch, the top plate is on it, and the mold film begins to spread to this position. 6. Put on the master ring and the slave ring, with the circular surface of the outer ring facing down. Press the upper pressure switch to press the outer ring tightly (it can be repeated for 2-3 times until the master and slave rings are tight), and then press the upper pressure switch to return the upper pressure seat to its original position. 7. Cut off the master ring and slave ring with a knife.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (silver glue) Page number: 5/27
Date: September 26th, 2005.
1. Objective: Strictly control the preparation process of silver paste to ensure the product quality. 2. Scope of use: glue making and silver paste dispensing process. 3. Equipment used: microscope, silver paste dispensing, fixture and die fixing pen. Four. Related documents:> V. Operation Specification 5. 1 Preparation of silver glue: Take the silver glue out of the refrigerator, thaw it for 30 minutes at room temperature, stir it evenly (about 20-30 minutes) after it is completely thawed, and put it into a dispensing syringe. 5.2 Place the arranged brackets on the fixture (one fixture contains 25), then flatten them with a clapper, and then dispense glue. 5.3 Put the arranged fixture on the microscope. Clean the crystal fixing area at the top of the lower bracket. 5.4 Adjust the dispensing machine for 0.2-0.4 seconds and the barometer knob for 0.05-0. 12Mpa, and then adjust the dispensing knob to make the dispensing amount meet the standard. 5.5 Point the silver glue at the center of the bracket (bowl) with a glue needle. 5.6 Repeat the action of 5.5, point to a row of brackets vertically, and then move to the right.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (silver glue) Page number: 6/27
Date: September 26th, 2005.
6. 1 dot silver paste should be moderate, and the silver paste can wrap the wafer when the chip is bonded. The height of the silver paste around the wafer should be above 1/3 and below 1/4. 6.2 The main point of the silver paste should be in the middle of the die bonding area (the eccentric distance is less than 1/36.3 of the wafer diameter), and the excess silver paste should be wiped on the bracket or other places with soft paper.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED operating instructions (die bonding) Page number: 7/27
Date: September 26th, 2005
1. Objective: To control the chip soldering process and ensure the product quality. 2. Scope of application: chip bonding process. 3. Equipment used: tool-microscope, chip bonding pen, chip bonding handset and fixture. 4. Relevant documents: semi-finished product inspection specifications and production work orders. 5. Prepare the operation specification 5. 1. The fixture used to fix the bracket is placed under the hand rest of the fixed mold and aligned with the microscope. When placing the bracket on the fixture, pay attention to the large side of the bracket on the left and the small side on the right. 3. Adjust the height and magnification of the microscope to make the die fixing area of the bracket clearest. 4. Adjust the height of the fixing handrail and try to fix the wafer. If the upper surface of the wafer fixing bracket is not detached from the adhesive tape, lower the mold fixing handrail. If the wafer approaches the support, it will be detached from the tape. You need to lift the handrail that holds the mold. 5. Adjust the lighting until you feel good about yourself. 5.2 The die fixing pen fixes the crystal grains in the silver glue center area of the bracket bowl. 5.3 Keep the fixed die pen and the fixed die holder at an angle of 30-45, and press the index finger against the tip of the pen. 5.4 The closing sequence is: from top to bottom, from left to right. 5.5 After fixing a group of supports in turn, remove the expansion.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED operating instructions (die bonding) Page number: 8/27
Date: September 26th, 2005.
5.6 Take the finished bracket lightly and put it in the specified position. 6. Quality requirements: 6. 1 The chip should be fixed to avoid affecting the quality. 6.2 Don't hang the chip on the silver glue to avoid the chip falling. 6.3 Don't stick the silver glue on the chip and the bracket, so as to avoid the difficulty of bonding and affect the quality.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED Operating Instructions (Chip Welding Quality Standard) Page: 9/27
Date: September 26th, 2005.
Determination and processing method of adhesive sheet specifications on adhesive sheet diagram
The amount of silver glue on any surface of the wafer accounts for 1/2- 1/4 of the height of the wafer, and more than two thirds of the periphery of the wafer remains glue-free. good
Keep the surface of the pad and the wafer free of glue, the wafer can't deviate from the middle position of the bottom of the bowl, and the bowl wall can't stick. good
The adhesive pad is bonded or contaminated. NG pads are bonded or contaminated. Remove the wafer, put it aside and handle it separately.
The position of the wafer is not correct, which seriously deviates from the middle position of the bottom of the bowl. NG gently pushes the wafer to the middle of the bottom of the bowl with a die pen.
Stent misalignment NG uses tweezers to correct the misaligned stent.
The wafer is not fixed in the die bonding area. (This happens mainly when the flat head support is used for die bonding) ng gently pushes the wafer to the middle position of the support with the die bonding pen.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED Work Instruction (Chip Welding Quality Standard) Page: 10/27
Date: September 26th, 2005.
Determination and processing method of adhesive sheet specifications on adhesive sheet diagram
Wafer dump NG grabs the wafer and fixes it again.
The amount of silver glue exceeds the PN junction too much, or the amount of glue on one of the four sides of the wafer exceeds the PN junction NG, so the wafer is clipped and fixed again.
The amount of silver paste accounts for less than 1/5 of the wafer height. If the amount of silver glue is too small, NG picks up the wafer with tweezers, adds some silver glue and fixes it back.
FixiNG the tilted wafer ng fixes the tilted wafer with a die pen.
The bottom of the wafer is not in complete contact with the silver paste NG, and the silver paste is patched evenly, and the wafer is fixed with a die-fixing pen.
If the aluminum pad is incomplete or the pad falls off more than 1/4 of the pad area, remove the wafer and re-fix it. If the quantity is too large, notify the quality control personnel.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of LED instruction manual (welding wire): 1 1/27
Date: September 26th, 2005.
1. Objective: To formulate the bonding process according to the correct specifications and ensure the product quality. Second, the scope of use: all LED lights Third, the use of machines, equipment, tools-wire bonder, tension tester, tweezers, temperature tester, stylus. Four. Related documents: semi-finished product inspection specification and production work order. V. Operating Specification 5. The temperature of the1wire bonder is generally set at about 220℃, and the grains with strict temperature requirements can be reduced to 180℃, and the grains without strict temperature requirements can be around 250℃. 5.2 The first solder joint pressure is set to 55 ~ 70g, and the second solder joint pressure is set to 90 ~ 1 15g. 5.3 The tension of the conductor is moderate, and the arc height h of the conductor is greater than 1/2 and less than 3/2. 5.4 The diameter of the first solder joint is 2~3 times that of the gold wire, and more than 2/3 of the solder joint should be on the electrode. 5.5 The welding wire shall be free from virtual welding, off-welding and broken welding, and can withstand the tensile force of more than 5g, and the tail wire shall not be too long. 6. Operating Specification 6. 1 When starting the machine, the operator shall adjust the machine, ultrasonic wave, power, time, pressure, radian and temperature, and conduct self-correction and inspection. If it is not adjusted well, the technician or foreman (group leader) may adjust it. 6.2 Take a bracket, turn it to the working position, and adjust the focal length and magnification of the microscope to a proper position. 6.3 Take one bracket with fixed grain at a time and send it to the welding wire station with the control panel. 6.4 Move the control box, press the microswitch, the welding nozzle drops, and the welding ball falls on the electrode to complete the first welding spot. 6.5 Move the control box so that the welding nozzle falls on the position of the second welding spot.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of LED instruction manual (welding wire): 12/27
Date: September 26th, 2005.
5.6 Loosen the microswitch, and the welding nozzle descends to complete the second welding spot. 5.7 Press the moving switch, the bracket moves one grid, and repeat the above steps 4~6 to complete the welding of 20 grains on a bracket. 5.8 ts 2 100 gold wire ball welding machine operation mode table. The figure is as follows: Description of working condition function item K 1 position K2.
Automatic displacement, automatic secondary welding, automatic feeding and automatic manual step locking are prohibited.
1 has a good adhesive sheet and frame, and the operator is skilled. This mode can give full play to the maximum efficiency of the machine.
When the second welding leg of the frame is not very good, this mode is easy to find the second welding defect, convenient for rework and faster.
In some cases, the chip is badly soldered, and so is the second solder leg of the frame. Using this mode can not only improve the speed, but also take into account the failure of secondary welding.
4 None, None, None, X X This is a full manual mode, which is mainly used for rework when automatic welding is not good. At the same time, this mode can be used for beginners to learn and for welding non-LED devices.
5. There is no defect in die bonding, but the second solder leg is good. This mode can not only improve the speed, but also take into account the inaccuracy of secondary welding.
6 None None this mode is obtained when the span of mode 5 is adjusted to zero, which can be used for poor chip bonding and secondary solder joint and beginners' learning.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of LED instruction manual (welding wire): 13/27
Date: September 26th, 2005.
7. Quality requirements 7. 1 Conduct full inspection according to the process and specifications. If it is unqualified, it will be returned for rework, and the remaining gold thread will be torn off during repair welding. 7.2 Test the welding wire tension as stipulated in the quality document, and adjust the machine if it is unqualified.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (quality standard for bonding wires) Page: 14/27
Date: September 26th, 2005.
Determination and processing method of wire specifications for wire drawing
The continuous welding wire ng broke the wrong gold thread due to the tangent error of the machine, and informed the engineering department to repair the machine.
If the radian is too high, and the radian height exceeds 16mil NG based on the support surface, pinch off the gold wire and repair the weld.
Pull out the bonding pad ng to wrap the chip and silver glue, and then re-fix the chip before bonding.
Incomplete or dropped bonding pads NG will scrape off the wafer and silver glue, so as to re-fix the wafer before bonding.
The length of the left tail cannot exceed the edge of the wafer, OK.
The left tail is too long, exceeding or touching the edge of the wafer. NG pinched off his tail with tweezers.
Stent misalignment NG uses tweezers to correct the misaligned stent.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (quality standard of bonding wire) Page: 15/27
Date: September 26th, 2005.
Determination and processing method of wire specifications for wire drawing
The crack area of the wafer is larger than 1/5 wafer area or cracks to the PN junction NG, scraping off the wafer and silver glue, and then re-soldering the wafer.
Loose weldiNG or virtual welding ng pinch off the gold wire before repairing it.
Adjust the radian of the gold wire with the tungsten wire at the bottom of the gold wire tread at the chip height ng.
Pull a straight line NG and pinch off the gold wire before repairing the wire.
The ball should be kept at a certain height and should not be pie-shaped.
The gold thread keeps a good radian, and the tension of the gold thread above 5g is OK.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (quality standard of bonding wire) Page: 16/27
Date: September 26th, 2005.
Determination and processing method of wire specifications for wire drawing
The ball of the first solder joint should fall within the scope of the solder pad, and the diameter of the ball should not be less than 1.5 times the diameter of the gold wire.
The area of wire ball exceeding 1/3 deviates to the outside of the pad, and ng takes off the wire ball and re-welds it.
The second solder joint should fall within the range of the four sides of the bracket. As shown by the dotted circle on the left, the range is ok.
The second point should be welded on the glossy surface, and the rough surface covered should not exceed 1/3 OK of the gold wire coverage area.
The stress point of gold thread in QC is at the second point, and the stress point of gold thread in NG QC should be at the first point.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of LED instruction manual (dispensing): 17/27
Date: September 26th, 2005.
Objective: To strictly control the dispensing process and ensure the product quality. Eight. Scope of use: glue preparation and distribution procedures. Equipment used: tools-electronic scale (accuracy above +0.2g), vacuum furnace, preheating furnace, beaker, stirring rod and filtering equipment. X. Relevant documents: XI production worksheet. Preheating 5. 1: Put glue A, glue CP and glue DP into a preheating oven at 70℃ in advance to preheat 1~2 hours, and take them out when mixing the glue. 5.2 How to use the electronic scale: put the empty beaker on the electronic scale, put the material after "zeroing", and the weight of the material will be displayed on the electronic scale. 5.3 Pour a proper amount of CP and DP into a big beaker, then pour glue A and mix well. Finally, add an appropriate amount of glue B, and then stir. The method is to stir clockwise for 3-4 minutes, then stir counterclockwise for 3-4 minutes, stir evenly, and filter out the impurities in the mixed glue. 5.5 Vacuum in a vacuum furnace for about 20 minutes, set the temperature at 50℃, and clean the air in the mixed glue. 6. Quality requirements: the glue is even, "free of impurities", and there is no bubble when used in the next process.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of LED instruction manual (dispensing): 18/27
Date: September 26th, 2005.
12. The quality requirements and operation specifications of 1 shall be operated by a dispensing machine, which shall be supervised by the shift foreman and the quality control department to prevent dispensing errors. 2. You need to try to fill in one before pasting it as it is, and you can start pouring glue only after confirming that the glue color is correct.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of LED instruction manual (adhesive): 19/27
Date: September 26th, 2005.
1. Purpose: Strictly control the gluing process to ensure the product quality; 2. Scope of application: gluing and pouring process; 3. Equipment: tools-oven, gluing machine, bracket tray, microscope and trocar; 4. Relevant documents: glue coating quality inspection specification; 5. Operating Specification 5. 1 The welded bracket needs to be put into the preheating oven about 30 minutes in advance. 5.2 Adjust the air valve, turn on the power supply, and adjust the drum speed knob for different products. 5.3 Adjust the dipping time: the pointer should be about 1 sec, and the dipping time for the deep bowl is longer and that for the shallow bowl is shorter. 5.4 Pour the glue into the glue tank along the roller direction. 5.5 Take out 1 the preheated bracket and insert it into the groove, and press the air valve switch. 5.6 Take out the bracket and observe it under a microscope to see if there is glue in the bowl (if there is no glue, it will take longer) and see if there are bubbles (if there are bubbles, pick them off with a needle and slow down) until there are no bubbles in the bowl and there is glue in the bowl. 5.7 Take 0.5K from the preheating plate at a time and put it next to the dipping machine. Insert the bracket into the groove with the left hand in the same direction, step on the air valve to dispense glue, and take it out with the right hand in the same direction and put it into the bracket tray (25 pieces per tray). Dip it in 0.5K, and send it to the next process for glue filling at one time, and take out the empty tray at the same time. Quality requirements of intransitive verbs. 1 The proportion of glue used for gluing and pouring is the same, so be careful of glue errors.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of LED instruction manual (adhesive): 20/27
Date: September 26th, 2005.
6.2 Wear gloves when operating. 6.3 1.5 ~ 2 hours to change the glue, wash the original glue with acetone, and then press another batch of glue.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of LED instruction manual (glue filling): 2 1/27
Date: September 26th, 2005.
Objective: To control the filling process and ensure the product quality. Scope of application: glue pouring process III. Use equipment and tools-gloves, aluminum plates, mold strips, glue filling machines and wrenches. Related documents: production work V. Operating specifications 5. 1 First, the prepared vacuum-pumped glue is slowly poured into the glue container from the inner wall of the plastic cup. Cover it after pouring the glue, and try to avoid the exposure time of the glue in the air. 5.2 Adjust the glue filling speed of the glue filling machine, and pay attention to the fact that the glue filling speed is too fast, which is easy to generate bubbles. 5.3 Put the mold strip into the glue injection position on the glue injection machine and start the glue injection machine. 5.4 After gluing, transfer the mold strip to the next working procedure. Quality requirements of intransitive verbs 6. 1 When pouring glue from a glue cup into a glue container, the speed should be controlled and kept at a constant speed, and the glue poured at one time should not exceed 2/3 of the glue container. At the same time, the poured colloid should make the cup wall flow downwards. 6.2 The filling speed of the glue filling machine should be adjusted well, not too fast, otherwise bubbles will easily occur, but not too slow, otherwise the production progress will be affected. 6.3 The glue filling machine must be cleaned every 4 hours.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED Job Description (Off-mold) Page: 22/27
Date: September 26th, 2005.
1. Objective: To strictly control the parting process and ensure the product quality. 2. Scope of application: parting process. 3. Equipment used: slitter, air compressor, plastic tray, mold tray, pliers and long baking tray. 4. Relevant documents: parting quality inspection specification. 5. Operation specification: 5. 1 Turn on the gas valve switch (if power supply is needed, turn on the power supply). 5.2 According to the short baking record, it is time to take the product out of the short oven and confirm whether it is baked well. If it is not baked well, it cannot be separated from the mold. It must be baked again, and it will not be released until it is baked. Quality requirements: the products are discharged before drying, and the foreman on duty and quality control are responsible for supervision.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
Page number of all job descriptions: 23/27
Date: September 26th, 2005.
1. Objective: Strictly control all working procedures to ensure product quality. 2. Scope of use: all processes. 3. Equipment used: tools-all machines, pliers, wrenches and gloves. 4. Relevant documents: production work orders. 5. Operating Specification 4. 1 Before cutting feet, classify them according to different names and specifications, and put the brackets in the same direction. 4.2 The specific mold used shall conform to the specifications of the bracket and the requirements of the production work order. 4.3 Cutting feet can be divided into tangent cutting and reverse cutting, generally tangent cutting, and reverse cutting when the chip polarity is reversed. See the requirements of the production work order for details. At this time, the upper die is vertical, and the lower die will hold the bracket, and the bracket will automatically return to its original position. Precautions for intransitive verbs 6. 1 In the process of cutting feet, special attention should be paid not to put them backwards to avoid cutting them backwards. 6.2 Before cutting feet, brackets should be placed neatly. 6.3 After cutting, the bracket should be placed neatly to avoid scratching the appearance and confusion. 6.4 Before operating the machine, you must check whether the safety switch is normal. If there is any fault, stop using it and notify the maintenance department for maintenance. 6.5 When the machine is stuck, you must stop the machine first and remove the material with tweezers. It is not allowed to take materials directly by hand.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED operating instructions (twice cutting) Page number: 25/27
Date: September 26th, 2005.
1. Objective: To strictly control the secondary cutting process and ensure the product quality. Second, the scope of use: secondary cutting process. Third, the use of equipment: tools-one or two cutting machines, gloves, rubber sheets. Four. Related documents: production work order V. Operation specification: 5. 1 Adjust the tailgate according to the customer's foot length requirements. 5.2 Push the top of the bottom of the bracket to be cut against the back plate of the foot cutter, and press the foot switch to complete the second cutting action. Precautions for intransitive verbs 6. 1 The foot switch can only be started after the bracket is completely placed in the correct position. 6.2 After LED is cut twice, there should be no burr, damage and other undesirable phenomena.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (package) Page number: 26/27
Date: September 26th, 2005.
1. Objective: To strictly control the packaging process and ensure the product quality. Second, the scope of use: packaging technology. Equipment used: tools-sealing machine, scissors, plastic bags, gloves. 4. Relevant documents: production worksheets, finished product inspection specifications and output statistics 5. Operation specification: 5. 1 Packaging according to customer requirements. Unless otherwise specified, the quantity of each package is 1000 pieces. 5.2 Desiccant should be put in the packaging bag and labeled, and can be sealed only after passing the quality control inspection. 5.3 When sealing, ensure that the seal is tight. Note for intransitive verbs: 6. The finished material in1must not have defects such as appearance, bubbles, deep planting, shallow planting, too much glue, too little glue, stains, cracks, dark circles, VF, and no brightness. And the quantity requirements must be accurate.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (test) Page number: 24/27
Date: September 26th, 2005.
Objective: Strictly control the testing process to ensure the product quality. 3. Scope of use: testing process. 3. Equipment used: tools-a tester, gloves, diagonal pliers and plastic boxes. 4. Relevant documents: production work orders. 5. Operating specifications: 5. 1 Set the operating standards of machine voltage and current according to different chip models. 5.2 According to different product names and specifications, the defective products are separated from the good products. Attention to intransitive verbs: 6. 1 For each kind of defects, the tester did detect them and can distinguish them. 6.2 In particular, the tester shall not mix materials. 6.3 The operator shall not debug the machine without authorization, and the debugging shall be approved by the foreman. 6.4 When testing two-color products, the part of the same color should be tested first, and then the part of another color should be tested to avoid missing the test. Quality requirements: 7. 1 after the test, pick out the bad LED lights, such as bubbles, stains, dull appearance, unevenness, VF, IR, eccentricity and other defects.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED operating instructions (baking) Page number: 27/27
Date: September 26th, 2005.
1. Objective: To strictly control the baking process and ensure the product quality. Second, the scope of use: solid crystal baking or glue pouring baking. Use of equipment and tools: oven, gloves, baking records. Four. Related documents: Production Work Order V. Operation Specification 5. 1 According to the baking requirements specified in the work order, set the baking temperatures corresponding to different product models. 5.2 When baking materials, the corresponding colors and ovens should be selected according to different materials for baking. 5.3 Generally speaking, the oven temperature is a constant tolerance of plus or minus 3 degrees. Precautions for intransitive verbs 6. 1 short baking of products 125 degrees, 3 degrees and 60 minutes; 6.23 product baking 125 degrees 3 degrees 6 hours; 5. The product is baked at125 3 degrees for 8 hours. 6.3 Note that the baking time should not be too long and shortened, resulting in poor quality.
XXXXXXXXX company document number: QI-ED-0 1
Version: A 1
LED instruction manual (baking) Page number: 27/27
Date: September 26th, 2005.
1. Objective: To strictly control the baking process and ensure the product quality. Second, the scope of use: solid crystal baking or glue pouring baking. Use of equipment and tools: oven, gloves, baking records. Four. Related documents: Production Work Order V. Operation Specification 5. 1 According to the baking requirements specified in the work order, set the baking temperatures corresponding to different product models. 5.2 Generally speaking, the oven temperature is a constant tolerance of plus or minus 3 degrees. Notes on intransitive verbs 6. 1 solid crystal baking 150 degrees for 90 minutes; 6.2 Note that the baking time should not be too long and shortened, resulting in poor quality.